MANUFACTURE OF ELECTRONIC COMPONENTS AND BOARDS

This sub-class includes the manufacture of : - diodes - light-emitting diodes (LED) - laser diodes - transistors - rectifiers

This sub-class includes the manufacture of finished or semi-finished semiconductor wafers or dice.

This sub-class includes the assembly and/or testing of semiconductors such as: - microprocessors - integrated circuits (analog, digital or hybrid)

This sub-class includes the manufacture of solar wafers.

This sub-class includes the manufacture of solar cells.

This sub-class includes the manufacture of semiconductor devices not elsewhere classified. Examples: - semiconductor circuit network manufacturing

This sub-class includes the manufacture of electronic fixed and/or variable capacitors.

This sub-class includes the manufacture of bare printed circuit boards without mounted electronic components.

This sub-class includes the manufacture of printed circuit boards with electronic components.

This sub-class includes the manufacture of piezo-electric devices, piezo-electric crystals, quartz crystals used in electronic application, such as quartz crystal filters and delay lines.

This sub-class includes the manufacture of electronic display components except light emitting diodes. Units in this sub-class include the manufacture of: - plasma display screens - polymer screens - LCD screens

This sub-class includes the manufacture of electronic connectors such as coaxial, cylindrical, rack, panel, pin, sleeve, printed circuit and/or fiber optic.

This sub-class includes the manufacture of other electronic components and boards not elsewhere classified. Examples: - printer cables, monitor cables, USB cables, etc. manufacturing - interface cards (e.g., sound, video, controllers, network, modems) manufacturing - electron tubes manufacturing - inductors (e.g., chokes, coils, transformers), electronic component type manufacturing - solenoid, switches and/or transducers for electronic application manufacturing